Automated Component Placement of Printed Circuit Boards

(in cooperation with Beko A.S. and Teletas A.S.)

The aim of this project is automated tolerance inspection of placement of circuit components that are inserted by specialized machines, and integration of obtained results with SPC and MRP II systems in order to update statistical process control and production plans. With this study, not only the tolerance inspection of circuits on the production queue are accomplished within the standards, but also the detection of machine which introduces the problem, the problematic components, and the determination of the manufacturing firm of problematic components is enabled. 

The automated data collection stage of the project is made possible by MRP II package and MFG/PRO integration systems and the CIM Interface module of the software, which are available in Bogazici University. Moreover, an SPC package, Quipsy, was also utilized in integration procedure.

The real-time application of the system accomplished by transferring the developed software to an image processing system that depends on the TMSC30 algorithm, speeding up the system for quality control on the production line.

The study also includes development of a user interface enabling the user to select a board and the components to be inspected and to interrupt the operation to change the selections. This introduces flexibility of inspecting all types of boards to the system.

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Please send mail to dogozgur@boun.edu.tr with questions or comments .
Last modified: 04-04-2001